Microwave Applications Seminar Call for Presentations: The Microwave Application Seminars (MicroApps) at the IEEE MTT-S International Microwave Symposium 2011 (IMS2011) will be presented in Baltimore, Maryland, from Tuesday, June 7 through Thursday, June 9, 2011. Exhibitors at the Symposium are invited to submit applications engineering technical seminars describing state-of-the-art products and processes of interest to the microwave community, to be considered for oral presentation, as well as electronic distribution, to IMS attendees.

Electronic Submission: Technical seminar proposals for presentation at this symposium must be submitted via email to microapps@ims2011.org. Please do not submit your proposal to MP Associates.

Deadlines:

• Seminar Proposals Due: December 3, 2010
• Proposal Selection Announcements: January 31, 2011
• Final Manuscripts for DVD Due: March 18, 2011
• Presentations Due: June 1, 2011
• All submissions (in PDF format) must be made via email: microapps@ims2011.org

Seminar Proposal Format: Seminar proposals (in English) must be submitted as one PDF (Acrobat v6.0 or newer) formatted file which contains:

1. Speaker information: name(s), title(s), affiliation, telephone # and email address.
2. A 100 to 200 word abstract describing the product or process, its importance to the microwave community and how it advances the state-of-the-art in an application.
3. A statement, using the company letterhead, authorizing IMS2011 to print your abstract and to record and publish your manuscript and technical presentation on a limited access website and/or DVD if your seminar is selected (this page should be concatenated with 1 and 2 to form one PDF).

The decision to accept a seminar for presentation is based on this summary and confirmation that your organization is a registered Exhibitor at IMS2011.

Seminar Selection Criteria: Each registered IMS2011 Exhibitor is invited to submit MicroApps seminar proposals. All submissions and presentations must be in English, and may cover new products, noteworthy state-of-the-art components, new technologies, manufacturing and design techniques incorporating the Exhibitor's products and technologies. These submissions will be reviewed by the IMS2011 MicroApps committee based on the abstract. Presentations are open to all IMS registrants and should appeal to the Exhibition attendees. The selection criteria include relevance and interest to MTT-S members and the local microwave community, as well as being a registered Exhibitor at IMS2011. The objective of MicroApps is to reach out to engineers new to a technical area and technicians. The purpose of MicroApps is to communicate practical knowledge. Tutorials and application notes on basic techniques and tribal knowledge are encouraged. Marketing, sales, or theoretical presentations are not appropriate for MicroApps. Presenters can invite attendees to visit their exhibit for further discussion.

Seminar Presentation Format:

PowerPoint presentations with embedded movies are strongly encouraged. The presentations are made in the MicroApps theater which will be located on the exhibit floor. Advanced acoustics will be employed that permit everyone inside the theater to hear the presentation and Exhibitors outside to conduct normal business. Your company will be given the opportunity to invite people to hear your presentation using an "Exhibition Only" pass to IMS2011.

Seminar presentations are typically 20 minutes in length. Time allocations for each presentation will be set by the review committee. Allotted presentation time may be reduced for multiple submissions from each Exhibitor. The file for the DVD should not exceed 30MB. The DVD is offered free of charge to all MicroApps attendees. Presentations should be by digital projection using the session PC and are due June 1, 2011. Recordings of the presentations may be made for distribution via restricted access website and/or DVD.

MicroApps Suggested Areas of Interest
(other topics will also be considered)

CAD and Modeling Products and Techniques

1

Design for Testability

2

Design for Manufacturability

3

System Design

Mechanical and Passive Components

4

Transmission Lines

5

Filters and Multiplexers

6

Ferrite and Acoustic Components

7

Conventional Passive Devices

8

MEMS Components and Technologies

Active Components

9

Digital and Mixed Signal Circuits

10

Oscillators and Frequency Sources

11

RF Power Devices and Amplifiers

12

Low-Noise Components and Receivers

13

Monolithic Microwave Integrated Circuits

14

New Semiconductor Technologies

15

Optoelectronics for microwave/mm-wave Applications

16

Superconducting Components and Technologies

17

Switches, Phase Shifters, Limiters, Mixers, Frequency Multipliers

Sub-Assemblies

18

Hybrids and Modules

19

Microwave Systems

20

Wireless and Cellular Communications

21

Broadband Communications

22

Sensors and Sensor Systems

23

RFID

Instrumentation and Measurement Techniques

24

Novel Testing Techniques

25

Assembly Test Techniques

26

Basic "Nuts and Bolts" Test Procedures

27

Wafer and Die RF Probe

28

Extreme Environments Evaluation

Other

29

Packaging and Interconnects

30

Manufacturing Processes